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- RD38F3352LLZDQ0
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RD38F3352LLZDQ0 Tech Specifications
Intel RD38F3352LLZDQ0 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 88Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Part Package Code | BGA | |
| Package Description | LFBGA, BGA88,8X12,32 | |
| Access Time-Max | 85 ns | |
| Number of Words | 8388608 wordsWord | |
| Number of Words Code | 8000000Words Codes | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA88,8X12,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| JESD-609 Code | e0 | |
| ECCN Code | EAR99 | |
| Terminal Finish | TIN LEAD | |
| Additional Feature | ALSO CONTAINS 128M BIT FLASH; CONTAINS 64M BIT PSRAM; CONTAINS 8 M BIT SRAM | |
| HTS Code | 8542.32.00.71 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 88 | |
| JESD-30 Code | R-PBGA-B88 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 2 V | |
| Temperature Grade | OTHER | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Operating Mode | SYNCHRONOUS | |
| Supply Current-Max | 0.045 mA | |
| Organization | 8MX16 | |
| Seated Height-Max | 1.4 mm | |
| Memory Width | 16 | |
| Standby Current-Max | 0.00015 A | |
| Memory Density | 134217728 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Mixed Memory Type | FLASH+PSRAM | |
| Length | 13 mm | |
| Width | 11 mm |
RD38F3352LLZDQ0 Documents
Download datasheets and manufacturer documentation for RD38F3352LLZDQ0
- DatasheetsINTLS02973-1.pdf
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