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RD28F3208C3T70 Tech Specifications

Intel  RD28F3208C3T70 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 66Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEL CORP
Part Package Code BGA
Package Description LFBGA, BGA68,8X12,32
Access Time-Max 70 ns
Number of Words 2097152 wordsWord
Number of Words Code 2000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA68,8X12,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 3 V
ECCN Code EAR99
Additional Feature SRAM IS ORGANIZED AS 512K X 16
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 240
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 66
JESD-30 Code R-PBGA-B66
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.3 V
Temperature Grade COMMERCIAL EXTENDED
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.055 mA
Organization 2MX16
Seated Height-Max 1.4 mm
Memory Width 16
Standby Current-Max 0.000006 A
Memory Density 33554432 bit
Memory IC Type MEMORY CIRCUIT
Mixed Memory Type FLASH+SRAM
Length 10 mm
Width 8 mm
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RD28F3208C3T70 Documents

Download datasheets and manufacturer documentation for   RD28F3208C3T70

  • Datasheets
RD28F3208C3T70 brand manufacturers: Intel Corporation, Twicea stock, RD28F3208C3T70 reference price.Intel Corporation. RD28F3208C3T70 parameters, RD28F3208C3T70 Datasheet PDF and pin diagram description download.You can use the RD28F3208C3T70 Specialized, DSP Datesheet PDF, find RD28F3208C3T70 pin diagram and circuit diagram and usage method of function,RD28F3208C3T70 electronics tutorials.You can download from the Twicea.