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LD8032AH

Intel  LD8032AH technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case Axial
Surface Mount NO
Supplier Device Package Axial
Number of Terminals 40Terminals
Package Description DIP,
Package Style IN-LINE
Package Body Material CERAMIC, GLASS-SEALED
Operating Temperature-Min -40 °C
Supply Voltage-Nom 5 V
Supply Voltage-Min 4.5 V
Operating Temperature-Max 85 °C
Manufacturer Part Number LD8032AH
Clock Frequency-Max 12 MHz
Package Code DIP
Package Shape RECTANGULAR
Manufacturer Rochester Electronics LLC
Part Life Cycle Code Active
Number of I/O Lines 32I/O Lines
Ihs Manufacturer ROCHESTER ELECTRONICS LLC
Supply Voltage-Max 5.5 V
Risk Rank 5.59
Operating Temperature -55°C ~ 175°C
Series CMF
Packaging Tape & Reel (TR)
Size / Dimension 0.090 Dia x 0.240 L (2.29mm x 6.10mm)
Tolerance ±0.1%
Part Status Active
Number of Terminations 2Terminations
Temperature Coefficient ±25ppm/°C
Resistance 81.6 kOhms
Composition Metal Film
Power (Watts) 0.5W, 1/2W
Additional Feature BOOLEAN PROCESSOR
Technology NMOS
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
JESD-30 Code R-GDIP-T40
Failure Rate --
Temperature Grade INDUSTRIAL
Speed 6 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Bit Size 8
Has ADC NO
DMA Channels NO
PWM Channels NO
DAC Channels NO
Seated Height-Max 5.72 mm
Address Bus Width 16
External Data Bus Width 8
Features Flame Retardant Coating, Moisture Resistant, Safety
Height Seated (Max) --
Width 15.24 mm
Length 52.325 mm
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