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EPM2210F256C4N Tech Specifications

Intel  EPM2210F256C4N technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Number of I/Os 204I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature IT CAN ALSO OPERATE AT 3.3V
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number EPM2210
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.5/3.32.5/3.3V
Supply Voltage-Min (Vsup) 2.375V
Programmable Type In System Programmable
Propagation Delay 9.1 ns
Output Function MACROCELL
Number of Macro Cells 1700Macro Cells
JTAG BST YES
Voltage Supply - Internal 2.5V 3.3V
Delay Time tpd(1) Max 7ns
Number of Logic Elements/Blocks 2210Logic Elements/Blocks
Length 17mm
Height Seated (Max) 2.2mm
Width 17mm
RoHS Status RoHS Compliant
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