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EPC16UI88N
Intel EPC16UI88N technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mounting Type | Surface Mount | |
| Package / Case | 88-LFBGA | |
| Surface Mount | YES | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tray | |
| Series | EPC | |
| Published | 2016 | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 88Terminations | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Voltage - Supply | ± 2.25V~6V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Supply Voltage | 3.3V | |
| Terminal Pitch | 0.8mm | |
| Reach Compliance Code | compliant | |
| Base Part Number | EPC16 | |
| JESD-30 Code | R-PBGA-B88 | |
| Qualification Status | Not Qualified | |
| Power Supplies | 3.3V | |
| Programmable Type | In System Programmable | |
| Memory Size | 16Mb | |
| Clock Frequency | 66.7MHz | |
| Supply Current-Max | 0.09mA | |
| Standby Current-Max | 0.00015A | |
| Memory Density | 16777216 bit | |
| Parallel/Serial | SERIAL | |
| Memory IC Type | CONFIGURATION MEMORY | |
| RoHS Status | RoHS Compliant |
EPC16UI88N
Download datasheets and manufacturer documentation for EPC16UI88N
- Datasheets88-UBGA Pkg Info Enhanced Configuration (EPC) Devices Datasheet EPC Series, SRAM Devices
- PCN PackagingMult Dev Dessicant Chg 19/Jul/2019 All Dev Pkg Chg 1/Aug/2018
- PCN Design/SpecificationMult Dev Substrate Material REV 25/Aug/2017 Mult Dev Substrate Material Chg 25/Aug/2017
- PCN Obsolescence/ EOLEPC/CS/CQ Device EOL 1/Jun/2017
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