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AGFB008R16A2E3E Tech Specifications

Intel  AGFB008R16A2E3E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case 0805 (2012 Metric)
Supplier Device Package 0805
Package Tape & Reel (TR)
Base Product Number RS73G2A
Mfr KOA Speer Electronics, Inc.
Product Status Active
Number of I/Os 384I/Os
Operating Temperature -55°C ~ 155°C
Series RS73
Size / Dimension 0.079 L x 0.049 W (2.00mm x 1.25mm)
Tolerance ±1%
Number of Terminations 2Terminations
Temperature Coefficient ±50ppm/°C
Resistance 4.22 MOhms
Composition Thick Film
Power (Watts) 0.25W, 1/4W
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes FPGA - 764K Logic Elements
Flash Size -
Features Automotive AEC-Q200, Moisture Resistant
Height Seated (Max) 0.024 (0.60mm)
Ratings AEC-Q200
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