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AGFB006R24C3E3V

Intel  AGFB006R24C3E3V technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Contact Plating Gold
Mount Bulkhead, Front Side Nut, Jam Nut, Panel
Package / Case -
Supplier Device Package -
RoHS Compliant
Number of I/Os 576I/Os
Package Tray
Mfr Intel
Product Status Active
Packaging Bulk
Operating Temperature 0°C ~ 100°C (TJ)
Series Agilex F
Termination Crimp
Connector Type Crimp, Receptacle
Number of Positions 66Positions
Max Operating Temperature 175 °C
Min Operating Temperature -65 °C
Gender Female
Fastening Type Threaded
Orientation Straight
Depth 46.02 mm
Number of Contacts 66Contacts
Plating Cadmium
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes FPGA - 573K Logic Elements
Flash Size -
Length 31.57 mm
Radiation Hardening No
Ratings Environment Resistant
AGFB006R24C3E3V brand manufacturers: Intel, Twicea stock, AGFB006R24C3E3V reference price.Intel. AGFB006R24C3E3V parameters, AGFB006R24C3E3V Datasheet PDF and pin diagram description download.You can use the AGFB006R24C3E3V Embedded - System On Chip (SoC), DSP Datesheet PDF, find AGFB006R24C3E3V pin diagram and circuit diagram and usage method of function,AGFB006R24C3E3V electronics tutorials.You can download from the Twicea.