- Integrated Circuits (ICs)
- Embedded - System On Chip (SoC)
- AGFA027R31C3E3E
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Mult. : 1
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AGFA027R31C3E3E
Intel AGFA027R31C3E3E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Package / Case | 1206 (3216 Metric) | |
| Supplier Device Package | 1206 | |
| Package | Tape & Reel (TR) | |
| Base Product Number | RN732B | |
| Mfr | KOA Speer Electronics, Inc. | |
| Product Status | Obsolete | |
| Number of I/Os | 720I/Os | |
| Operating Temperature | -55°C ~ 155°C | |
| Series | RN73 | |
| Size / Dimension | 0.126 L x 0.063 W (3.20mm x 1.60mm) | |
| Tolerance | ±1% | |
| Number of Terminations | 2Terminations | |
| Temperature Coefficient | ±50ppm/°C | |
| Resistance | 111 Ohms | |
| Composition | Thin Film | |
| Power (Watts) | 0.125W, 1/8W | |
| Speed | 1.4GHz | |
| RAM Size | 256KB | |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | |
| Peripherals | DMA, WDT | |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Architecture | MPU, FPGA | |
| Primary Attributes | FPGA - 2.7M Logic Elements | |
| Flash Size | - | |
| Features | Moisture Resistant | |
| Height Seated (Max) | 0.028 (0.70mm) |
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