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F1152NBGI Tech Specifications
IDT F1152NBGI technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 8 Weeks | |
| Package / Case | QFN EP | |
| Surface Mount | YES | |
| Number of Pins | 36Pins | |
| Power Dissipation (Max) | 2.2W | |
| Published | 2012 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 36Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | MATTE TIN | |
| Max Operating Temperature | 100°C | |
| Min Operating Temperature | -40°C | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | QUAD | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Supply Voltage | 5V | |
| Terminal Pitch | 0.5mm | |
| Frequency | 2.2GHz | |
| Pin Count | 36 | |
| Operating Supply Voltage | 5.25V | |
| Operating Supply Current | 327mA | |
| Power Dissipation | 2.2W | |
| Gain | 8.5 dB | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Noise Figure | 10 dB | |
| Length | 6mm | |
| Height Seated (Max) | 0.8mm | |
| Width | 6mm | |
| Thickness | 800μm | |
| Radiation Hardening | No | |
| RoHS Status | RoHS Compliant | |
| Lead Free | Lead Free |
F1152NBGI Documents
Download datasheets and manufacturer documentation for F1152NBGI
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