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89TTM552BL Tech Specifications

IDT  89TTM552BL technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 960Terminals
Manufacturer Part Number 89TTM552BL
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA
Package Description 35 X 35 MM, 1 MM PITCH, FPBGA-960
Risk Rank 5.66
Operating Temperature-Max 85 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 1.89 V
Supply Voltage-Nom 1.8 V
Reflow Temperature-Max (s) 30
Supply Voltage-Min 1.71 V
JESD-609 Code e0
ECCN Code 5A991
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Reach Compliance Code not_compliant
Pin Count 960
JESD-30 Code S-PBGA-B960
Qualification Status Not Qualified
Temperature Grade OTHER
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Seated Height-Max 3.29 mm
Length 35 mm
Width 35 mm
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