Integrated Device Technology (IDT) 89HPES12NT3ZBBCG8 Specialized Interfaces 324Pins 324Terminations BOTTOM

: Integrated Device Technology (IDT)

Mfr. : 89HPES12NT3ZBBCG8

Twicea : 1179-509-89HPES12NT3ZBBCG8

: BGA

: Interface: PCI Express,Packaging: Tape & Reel (TR),Terminal Position: BOTTOM,Pin Count: 324

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Factory Lead Time	10 Weeks
Mount	Surface Mount
Package / Case	BGA
Number of Pins	324Pins
Operating Temperature (Max.)	70°C
Packaging	Tape & Reel (TR)
Published	1999
JESD-609 Code	e1
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	324Terminations
ECCN Code	EAR99
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code	8542.39.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	260
Supply Voltage	1V
Terminal Pitch	1mm
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Pin Count	324
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	1.1V
Power Supplies	13.3V
Temperature Grade	COMMERCIAL
Supply Voltage-Min (Vsup)	0.9V
Interface	PCI Express
uPs/uCs/Peripheral ICs Type	BUS CONTROLLER, PCI
Clock Frequency	125MHz
Bus Compatibility	PCI; SMBUS
Data Transfer Rate-Max	6000 MBps
Length	19mm
Height Seated (Max)	1.5mm
Width	19mm
Thickness	1.4mm
RoHS Status	RoHS Compliant
Lead Free	Lead Free