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BSS138NH6327XTSA2 Tech Specifications

Infineon  BSS138NH6327XTSA2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Number of Pins 3Pins
Transistor Element Material SILICON
Current - Continuous Drain (Id) @ 25℃ 230mA Ta
Drive Voltage (Max Rds On, Min Rds On) 4.5V 10V
Number of Elements 1 Element
Power Dissipation (Max) 360mW Ta
Turn Off Delay Time 6.7 ns
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Series SIPMOS®
Published 2002
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
Termination SMD/SMT
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Additional Feature LOGIC LEVEL COMPATIBLE
Terminal Position DUAL
Terminal Form GULL WING
Pin Count 3
Configuration SINGLE WITH BUILT-IN DIODE
Voltage 50V
Current 2A
Operating Mode ENHANCEMENT MODE
Power Dissipation 360mW
Turn On Delay Time 2.3 ns
FET Type N-Channel
Rds On (Max) @ Id, Vgs 3.5 Ω @ 230mA, 10V
Vgs(th) (Max) @ Id 1.4V @ 26μA
Halogen Free Halogen Free
Input Capacitance (Ciss) (Max) @ Vds 41pF @ 25V
Gate Charge (Qg) (Max) @ Vgs 1.4nC @ 10V
Rise Time 3ns
Vgs (Max) ±20V
Fall Time (Typ) 8.2 ns
Continuous Drain Current (ID) 230mA
Threshold Voltage 1V
Gate to Source Voltage (Vgs) 20V
Max Dual Supply Voltage 60V
Dual Supply Voltage 60V
Recovery Time 14.5 ns
Nominal Vgs 1 V
Width 3.05mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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