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BGS15GA14E6327XTSA1
Infineon BGS15GA14E6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 6 Weeks | |
| Package / Case | 14-UFQFN Exposed Pad | |
| Surface Mount | YES | |
| Operating Temperature | -30°C~85°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2016 | |
| JESD-609 Code | e4 | |
| Pbfree Code | yes | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 14Terminations | |
| Terminal Finish | Gold/Nickel (Au/Ni) | |
| HTS Code | 8542.39.00.01 | |
| Voltage - Supply | 3V | |
| Terminal Position | QUAD | |
| Terminal Form | BUTT | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Supply Voltage | 3V | |
| Frequency | 6GHz | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | S-XQMA-B14 | |
| Circuit | SP5T | |
| Impedance | 50Ohm | |
| Frequency Range | 100MHz~6GHz | |
| Insertion Loss | 0.65dB | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Isolation | 27dB | |
| Length | 2mm | |
| Height Seated (Max) | 0.65mm | |
| Width | 2mm | |
| RoHS Status | Non-RoHS Compliant |
BGS15GA14E6327XTSA1
Download datasheets and manufacturer documentation for BGS15GA14E6327XTSA1
- DatasheetsBGS15GA14
- PCN PackagingMult Dev Packing Box Chg 18/Oct/2019
- Other Related DocumentsPart Number Guide
- PCN Obsolescence/ EOLMult Dev EOL-REV 6/Sep/2019 Mult Dev EOL 4/Sep/2019
- ConflictMineralStatementInfineon-company-51.pdf
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