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BGS110MN20E6327XTSA1
Infineon BGS110MN20E6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 6 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Package / Case | 20-WFQFN Exposed Pad | |
| Operating Temperature | -30°C~85°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2014 | |
| Part Status | Last Time Buy | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 20Terminations | |
| HTS Code | 8542.39.00.01 | |
| Voltage - Supply | 2.5V~5.5V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BUTT | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Supply Voltage | 3.5V | |
| Terminal Pitch | 0.4mm | |
| Frequency | 2.7Hz | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | S-XBCC-B20 | |
| Operating Supply Voltage | 5V | |
| Circuit | SP10T | |
| Test Frequency | 2.7GHz | |
| Impedance | 50Ohm | |
| Halogen Free | Halogen Free | |
| Frequency Range | 100MHz~2.7GHz | |
| Insertion Loss | 0.6dB | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Insertion Loss (dB) | 0.4 dB | |
| RF Type | General Purpose | |
| Length | 2.3mm | |
| Height Seated (Max) | 0.77mm | |
| Width | 2.3mm | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
BGS110MN20E6327XTSA1
Download datasheets and manufacturer documentation for BGS110MN20E6327XTSA1
- PCN PackagingMult Dev Packing Box Chg 18/Oct/2019
- Other Related DocumentsPart Number Guide
- PCN Obsolescence/ EOLMult Dev EOL 20/Jan/2020
- Simulation ModelsInfineon-RF-Switch-AWR-MWO-Design-Kit-SM-v02_00-EN Spice Model
- ConflictMineralStatementInfineon-company-51.pdf
- Datasheets
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