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- BGA8U1BN6E6327XTSA1
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BGA8U1BN6E6327XTSA1 Tech Specifications
Infineon BGA8U1BN6E6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 12 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | 6-XFDFN | |
| Surface Mount | YES | |
| Operating Temperature (Max.) | 85°C | |
| Operating Temperature (Min.) | -40°C | |
| Usage Level | Industrial grade | |
| Packaging | Tape & Reel (TR) | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 6Terminations | |
| Voltage - Supply | 1.6V~3.1V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BUTT | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Supply Voltage | 2.8V | |
| Terminal Pitch | 0.4mm | |
| Frequency | 5.15GHz~5.85GHz | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | R-XBCC-B6 | |
| Temperature Grade | INDUSTRIAL | |
| Number of Channels | 1Channel | |
| Test Frequency | 5.15GHz~5.85GHz | |
| Current - Supply | 4mA | |
| Gain | 13.7 dB | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Noise Figure | 1.6dB ~ 5dB | |
| P1dB | -5dBm | |
| Height Seated (Max) | 0.4mm | |
| Width | 0.7mm | |
| RoHS Status | ROHS3 Compliant |
BGA8U1BN6E6327XTSA1 Documents
Download datasheets and manufacturer documentation for BGA8U1BN6E6327XTSA1
- DatasheetsBGA8U1BN6
- PCN PackagingMult Dev Packing Box Chg 18/Oct/2019
- ConflictMineralStatementInfineon-company-51.pdf
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