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BGA416E6327HTSA1

Infineon  BGA416E6327HTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 6 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-253-4, TO-253AA
Number of Pins 4Pins
Packaging Tape & Reel (TR)
Published 2005
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Operating Temperature 150°C
Min Operating Temperature -65°C
Max Power Dissipation 100mW
Voltage - Supply 2.5V~5V
Construction COMPONENT
Frequency 100MHz~3GHz
Operating Supply Voltage 3V
Number of Channels 1Channel
Test Frequency 1.8GHz
Power Dissipation 100mW
Current - Supply 5.5mA
Halogen Free Not Halogen Free
Gain 11dB
RF/Microwave Device Type WIDE BAND LOW POWER
RF Type Cellular, GSM, CDMA, TDMA, UMTS
Input Power-Max (CW) 8dBm
Characteristic Impedance 50Ohm
Noise Figure 1.6dB
P1dB -3dBm
Height 900μm
Length 2.9mm
Width 1.3mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

BGA416E6327HTSA1

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