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BB837E6327HTSA1 Tech Specifications

Infineon  BB837E6327HTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 4 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case SC-76, SOD-323
Number of Pins 2Pins
Diode Element Material SILICON
Number of Elements 1 Element
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2005
JESD-609 Code e3
Pbfree Code yes
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
ECCN Code EAR99
Terminal Finish Tin (Sn)
HTS Code 8541.10.00.80
Capacitance 6pF
Voltage - Rated DC 30V
Terminal Position DUAL
Terminal Form GULL WING
Diode Type Single
Forward Current 20mA
Halogen Free Not Halogen Free
Capacitance @ Vr, F 0.52pF @ 28V 1MHz
Frequency Band S B
Diode Capacitance-Nom 6.6pF
Capacitance Ratio 12
Capacitance Ratio Condition C1/C25
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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