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BAS21E6327HTSA1 Tech Specifications

Infineon  BAS21E6327HTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 11 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Number of Pins 3Pins
Diode Element Material SILICON
Number of Elements 1 Element
Breakdown Voltage / V 250V
Packaging Tape & Reel (TR)
Published 2005
JESD-609 Code e3
Pbfree Code yes
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
Termination SMD/SMT
ECCN Code EAR99
Terminal Finish Tin (Sn)
Max Operating Temperature 150°C
Min Operating Temperature -65°C
HTS Code 8541.10.00.70
Capacitance 5pF
Max Power Dissipation 350mW
Terminal Position DUAL
Terminal Form GULL WING
Current Rating 200mA
Base Part Number BAS21
Pin Count 3
Voltage 250V
Element Configuration Single
Speed Fast Recovery =< 500ns, > 200mA (Io)
Current 2A
Diode Type Standard
Current - Reverse Leakage @ Vr 100nA @ 200V
Output Current 250mA
Voltage - Forward (Vf) (Max) @ If 1.25V @ 200mA
Forward Current 250mA
Operating Temperature - Junction 150°C Max
Halogen Free Not Halogen Free
Current - Average Rectified (Io) 250mA DC
Forward Voltage 1V
Max Reverse Voltage (DC) 200V
Average Rectified Current 250mA
Reverse Recovery Time 50 ns
Peak Reverse Current 100nA
Max Repetitive Reverse Voltage (Vrrm) 200V
Capacitance @ Vr, F 5pF @ 0V 1MHz
Peak Non-Repetitive Surge Current 4A
Max Forward Surge Current (Ifsm) 4A
Height 1mm
Length 2.9mm
Width 1.3mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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