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BAS2103WE6327HTSA1 Tech Specifications

Infineon  BAS2103WE6327HTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 5 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case SC-76, SOD-323
Number of Pins 2Pins
Diode Element Material SILICON
Number of Elements 1 Element
Packaging Tape & Reel (TR)
Published 2007
JESD-609 Code e3
Pbfree Code yes
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
ECCN Code EAR99
Max Operating Temperature 150°C
Min Operating Temperature -65°C
HTS Code 8541.10.00.70
Capacitance 5pF
Voltage - Rated DC 200V
Terminal Position DUAL
Terminal Form GULL WING
Current Rating 250mA
Base Part Number BAS21-03W
Pin Count 2
Reference Standard AEC-Q101
Element Configuration Single
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Standard
Current - Reverse Leakage @ Vr 100nA @ 200V
Output Current 250mA
Voltage - Forward (Vf) (Max) @ If 1.25V @ 200mA
Forward Current 200mA
Operating Temperature - Junction 150°C Max
Current - Average Rectified (Io) 250mA DC
Forward Voltage 1.25V
Max Reverse Voltage (DC) 200V
Average Rectified Current 250mA
Reverse Recovery Time 50 ns
Peak Reverse Current 100nA
Max Repetitive Reverse Voltage (Vrrm) 200V
Capacitance @ Vr, F 5pF @ 0V 1MHz
Peak Non-Repetitive Surge Current 4A
Reverse Voltage 200V
Max Forward Surge Current (Ifsm) 4A
Max Junction Temperature (Tj) 150°C
Height 1.1mm
Length 1.7mm
Width 1.25mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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