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EM30MSD Tech Specifications
Hirose EM30MSD technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 12 Weeks | |
| Contact Plating | Silver, Tin | |
| Mount | Flanges, Free Hanging, Panel | |
| Mounting Type | Free Hanging (In-Line); Panel Mount | |
| Mounting Feature | Flange | |
| Shell Material | Polybutylene Terephthalate (PBT) | |
| Insert Material | Polybutylene Terephthalate (PBT) | |
| Contact Finish Mating | Silver, Tin | |
| Contact Materials | Copper Alloy | |
| Voltage Rated | 250VAC/DC 1500VAC/DC | |
| Operating Temperature | -40°C~105°C | |
| Packaging | Tray | |
| Series | EM30MSD | |
| Published | 2014 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Crimp, Screw | |
| Connector Type | Plug and Receptacle | |
| Number of Positions | 2 (1 + 1 Power)Position | |
| Color | Orange | |
| Fastening Type | Bayonet Lock | |
| Current Rating (Amps) | 1A 200A | |
| Shielding | Unshielded | |
| Ingress Protection | IP68 - Dust Tight, Waterproof | |
| Reach Compliance Code | unknown | |
| Current Rating | 200A | |
| Shell Size - Insert | 30 | |
| Features | Board Guide, Interlocking Switch | |
| Contact Finish Thickness - Mating | 118.1μin 3.00μm 39.4μin 1.00μm | |
| RoHS Status | RoHS Compliant | |
| Ratings | Dust Tight, IP68, Waterproof |
EM30MSD Documents
Download datasheets and manufacturer documentation for EM30MSD
- DatasheetsEM30MSD Series Datasheet EM30MSD Series Flyer EM30MSD Drawing
- Mfg CAD ModelsEM30MSD.igs EM30MSD.stp
- PCN Design/SpecificationEM30MSD Pressing Plate Ribs Feb/2016
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