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DX10-28S(50) Tech Specifications
Hirose DX10-28S(50) technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 8 Weeks | |
| Contact Plating | Gold | |
| Housing Material | Zinc | |
| Insulation Materials | Polybutylene | |
| Published | 2005 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 28Terminations | |
| Termination | DIP | |
| ECCN Code | EAR99 | |
| Connector Type | TELECOM AND DATACOM CONNECTOR | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -55°C | |
| Gender | Female | |
| HTS Code | 8536.69.40.30 | |
| Pitch | 1.27mm | |
| Orientation | Right Angle | |
| Depth | 18.3mm | |
| Reach Compliance Code | unknown | |
| Current Rating | 500mA | |
| Voltage - Rated AC | 125V | |
| Insulation Resistance | 250MOhm | |
| Max Voltage Rating (AC) | 125V | |
| Max Current Rating | 500mA | |
| Number of Ports | 1Port | |
| Length | 38.48mm | |
| RoHS Status | RoHS Compliant | |
| Lead Free | Lead Free |
DX10-28S(50) Documents
Download datasheets and manufacturer documentation for DX10-28S(50)
- DatasheetsDX Series
- Mfg CAD ModelsDX10-28S(50).igs DX10-28S(50).stp
- PCN Design/SpecificationMult devs Material manufacturer chg 23/AUG/2018
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