H3194-01 Tech Specifications

Harwin  H3194-01 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 9 Weeks
Material Brass
Mounting Hole Diameter 0.093 ~ 0.097 (2.37mm ~ 2.46mm)
Contact Materials Beryllium Copper
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2009
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Connector, PCB, Socket
HTS Code 8536.90.40.00
Reach Compliance Code not_compliant
Current Rating 2A
Contact Finish Gold
Number of Contacts 1Contact
Plating Tin
Hole Diameter 2.47 mm
Flange Diameter 0.125 (3.18mm)
Outside Diameter 3.18 mm
Tail Type Standard Tail
Accepts Pin Diameter 0.035 ~ 0.041 (0.89mm ~ 1.05mm)
Socket Depth 0.169 4.28mm
Pin Hole Diameter 0.040 (1.02mm)
Insertion Force 3.00N ~ 9.00N
Length 13.3604mm
Contact Finish Thickness 5.90μin 0.150μm
Length - Overall 0.526 13.35mm
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
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H3194-01 Documents

Download datasheets and manufacturer documentation for   H3194-01

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