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H3190-01 Tech Specifications

Harwin  H3190-01 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 13 Weeks
Material Brass
Mounting Hole Diameter 0.039 ~ 0.043 (0.99mm ~ 1.09mm)
Contact Materials Beryllium Copper
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2009
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Connector, PCB, Signal
HTS Code 8536.90.40.00
Current Rating 2A
Contact Finish Gold
Number of Contacts 1Contact
Plating Tin
Terminal and Terminal Block Type PCB TERMINAL
Hole Diameter 1.0922 mm
Flange Diameter 0.057 (1.45mm)
Tail Type No Tail
Accepts Pin Diameter 0.018 ~ 0.020 (0.46mm ~ 0.51mm)
Socket Depth 0.091 2.30mm
Pin Hole Diameter 0.042 (1.07mm)
Insertion Force 2.00N ~ 6.00N
Length 2.9972mm
Contact Finish Thickness 3.94μin 0.10μm
Length - Overall 0.118 3.00mm
RoHS Status ROHS3 Compliant
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H3190-01 Documents

Download datasheets and manufacturer documentation for   H3190-01

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