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H3185-01 Tech Specifications

Harwin  H3185-01 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 9 Weeks
Material Brass
Mounting Hole Diameter 0.086 ~ 0.090 (2.18mm ~ 2.29mm)
Contact Materials Beryllium Copper
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2009
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Connector, PCB, Socket
HTS Code 8536.69.40.40
Current Rating 10A
Contact Finish Gold
Number of Contacts 1Contact
Plating Tin
Hole Diameter 2.29 mm
Flange Diameter 0.125 (3.18mm)
Outside Diameter 3.18 mm
Tail Type No Tail
Accepts Pin Diameter 0.035 ~ 0.041 (0.89mm ~ 1.05mm)
Socket Depth 0.140 3.56mm
Insertion Force 3.00N ~ 9.00N
Length 5.9944mm
Contact Finish Thickness 5.90μin 0.150μm
Length - Overall 0.236 6.00mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
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H3185-01 Documents

Download datasheets and manufacturer documentation for   H3185-01

H3185-01 brand manufacturers: Harwin Inc., Twicea stock, H3185-01 reference price.Harwin Inc.. H3185-01 parameters, H3185-01 Datasheet PDF and pin diagram description download.You can use the H3185-01 Terminals - PC Pin Receptacles, Socket Connectors, DSP Datesheet PDF, find H3185-01 pin diagram and circuit diagram and usage method of function,H3185-01 electronics tutorials.You can download from the Twicea.