H3169-05 Tech Specifications

Harwin  H3169-05 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 13 Weeks
Mount Through Hole
Mounting Hole Diameter 0.086 ~ 0.088 (2.18mm ~ 2.24mm)
Contact Materials Beryllium Copper
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2009
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Press-Fit, Knurled
ECCN Code EAR99
Connector Type Connector, PCB, Socket
HTS Code 8536.90.40.00
Contact Finish Gold
Number of Contacts 1Contact
Hole Diameter 2.2352 mm
Flange Diameter 0.125 (3.18mm)
Tail Type No Tail
Accepts Pin Diameter 0.035 ~ 0.041 (0.89mm ~ 1.05mm)
Socket Depth 0.140 3.56mm
Insertion Force 3.00N ~ 9.00N
Length 5.9944mm
Contact Finish Thickness 5.90μin 0.150μm
Length - Overall 0.236 6.00mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
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H3169-05 Documents

Download datasheets and manufacturer documentation for   H3169-05

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