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H3167-01 Tech Specifications

Harwin  H3167-01 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 13 Weeks
Mount Through Hole
Mounting Hole Diameter 0.086 ~ 0.088 (2.18mm ~ 2.24mm)
Contact Materials Beryllium Copper
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2009
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Press-Fit, Knurled
ECCN Code EAR99
HTS Code 8536.90.40.00
Reach Compliance Code not_compliant
Contact Finish Gold
Number of Contacts 1Contact
Hole Diameter 2.2352 mm
Flange Diameter 0.125 (3.18mm)
Tail Type No Tail
Accepts Pin Diameter 0.035 ~ 0.041 (0.89mm ~ 1.05mm)
Socket Depth 0.183 4.65mm
Insertion Force 3.00N ~ 9.00N
Length 5.9944mm
Contact Finish Thickness 5.90μin 0.150μm
Length - Overall 0.236 6.00mm
RoHS Status ROHS3 Compliant
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H3167-01 Documents

Download datasheets and manufacturer documentation for   H3167-01

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