H3155-01 Tech Specifications

Harwin  H3155-01 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 13 Weeks
Material Brass
Mounting Hole Diameter 0.039 ~ 0.043 (0.99mm ~ 1.09mm)
Contact Materials Beryllium Copper
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2010
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Connector, PCB, Signal, Socket
HTS Code 8536.90.40.00
Current Rating 2A
Contact Finish Gold
Number of Contacts 1Contact
Plating Tin
Terminal and Terminal Block Type PCB TERMINAL
Hole Diameter 1.1 mm
Flange Diameter 0.057 (1.45mm)
Tail Type No Tail
Accepts Pin Diameter 0.018 ~ 0.020 (0.46mm ~ 0.51mm)
Socket Depth 0.124 3.15mm
Pin Hole Diameter 0.043 (1.09mm)
Insertion Force 2.00N ~ 6.00N
Length 3.6068mm
Contact Finish Thickness 3.94μin 0.10μm
Length - Overall 0.142 3.61mm
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
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