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D0816-01 Tech Specifications

Harwin  D0816-01 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Through Hole
Mounting Type Through Hole
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Number of Positions or Pins (Grid) 16 (2 x 8)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Contact Finish Mating Gold
Contact Materials Copper
Insulation Materials Polybutylene
Operating Temperature -55°C~125°C
Packaging Bulk
Series D0
Published 2008
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Wire Wrap
ECCN Code EAR99
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Positions 16Positions
Number of Rows 2Rows
HTS Code 8536.69.40.40
Voltage - Rated DC 150V
Orientation Straight
Depth 10.02mm
Reach Compliance Code not_compliant
Current Rating 1A
Pitch - Mating 0.100 2.54mm
Voltage - Rated AC 100V
Number of Contacts 16Contacts
Contact Finish - Post Tin
PCB Contact Pattern RECTANGULAR
Body Breadth 0.4 inch
Lead Length 12.954mm
Contact Style RND PIN-SKT
Contact Resistance 10mOhm
Insulation Resistance 10GOhm
Row Spacing 7.62 mm
Mating Contact Pitch 0.1 inch
Termination Post Length 0.510 12.95mm
Pitch - Post 0.100 2.54mm
Features Open Frame
Length 20.3mm
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 196.9μin 5.00μm
Material Flammability Rating UL94 V-0
RoHS Status Non-RoHS Compliant
Flammability Rating UL94 V-0
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D0816-01 Documents

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