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D0808-01 Tech Specifications

Harwin  D0808-01 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Through Hole
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Number of Positions or Pins (Grid) 8 (2 x 4)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Contact Finish Mating Gold
Operating Temperature -55°C~125°C
Packaging Bulk
Series D0
Published 2008
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Wire Wrap
ECCN Code EAR99
Type DIP, 0.3 (7.62mm) Row Spacing
HTS Code 8536.69.40.40
Current Rating (Amps) 1A
Terminal Pitch 2.54mm
Reach Compliance Code not_compliant
Pitch - Mating 0.100 2.54mm
Body Length or Diameter 0.4 inch
Number of Contacts 8Contacts
Contact Finish - Post Tin
PCB Contact Pattern RECTANGULAR
Body Breadth 0.4 inch
Body Depth 0.193 inch
Contact Style RND PIN-SKT
Contact Resistance 10mOhm
Mating Contact Pitch 0.1 inch
PCB Contact Row Spacing 0.3 mm
Termination Post Length 0.510 12.95mm
Pitch - Post 0.100 2.54mm
Features Open Frame
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 196.9μin 5.00μm
Material Flammability Rating UL94 V-0
RoHS Status Non-RoHS Compliant
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D0808-01 Documents

Download datasheets and manufacturer documentation for   D0808-01

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