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D01-9500842 Tech Specifications

Harwin  D01-9500842 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Contact Plating Gold
Mount Through Hole
Mounting Type Through Hole
Package / Case SIP
Number of Pins 8Pins
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Number of Positions or Pins (Grid) 8 (1 x 8)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Contact Finish Mating Gold
Operating Temperature -55°C~125°C
Packaging Bulk
Series D01-950
Published 2010
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type SIP
Max Operating Temperature 125°C
Min Operating Temperature -55°C
Current Rating (Amps) 1A
Current Rating 1A
Pitch - Mating 0.100 2.54mm
Contact Finish - Post Tin
Lead Length 3.2004mm
Contact Resistance 10mOhm
Termination Post Length 0.126 3.20mm
Pitch - Post 0.100 2.54mm
Features Elevated
Contact Finish Thickness - Mating 29.5μin 0.75μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Flammability Rating UL94 V-0
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