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MWS5101EL2 Tech Specifications

HARRIS  MWS5101EL2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Weight 0.5 kg
Number of Terminals 22Terminals
Gross weight 526.67
Transport packaging size/quantity 42*28*15/30
Analog POS40
Execution tube
Melting temperature 183...240 °C
Soldering temperature 285...330 °C
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR
Package Description DIP, DIP22,.4
Access Time-Max 250 ns
Number of Words 256 wordsWord
Number of Words Code 256Words Codes
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP22,.4
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Nom (Vsup) 5 V
Packaging coil
JESD-609 Code e0
ECCN Code EAR99
Type RUICHI Tin-Lead Solder Sn/Pb with flux, soft
Terminal Finish TIN LEAD
HTS Code 8542.32.00.41
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
JESD-30 Code R-PDIP-T22
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 6.5 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 4 V
Number of Ports 1Port
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.008 mA
Organization 256X4
Output Characteristics 3-STATE
Memory Width 4
Standby Current-Max 0.00001 A
Memory Density 1024 bit
Parallel/Serial PARALLEL
I/O Type SEPARATE
Memory IC Type STANDARD SRAM
Standby Voltage-Min 2 V
Output Enable YES
Diameter 0.6 mm
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MWS5101EL2 Documents

Download datasheets and manufacturer documentation for   MWS5101EL2

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