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GS8662TT37BGD-400

GSI  GS8662TT37BGD-400 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 8 Weeks
Package / Case BGA-165
Surface Mount YES
Number of Terminals 165Terminals
Maximum Clock Rate 400 MHz
Supplier Package FBGA
Data Rate Architecture DDR
Typical Operating Supply Voltage 1.8000 V
Minimum Operating Supply Voltage 1.7 V
Timing Type Synchronous
Number of Words 2 MWordsWord
Number of I/O Lines 36 BitI/O Line
Maximum Operating Supply Voltage 1.9 V
Mounting Surface Mount
Moisture Sensitive Yes
Maximum Clock Frequency 400 MHz
Maximum Operating Temperature + 70 C
Supply Voltage-Max 1.9 V
Minimum Operating Temperature 0 C
Factory Pack QuantityFactory Pack Quantity 15
Supply Voltage-Min 1.7 V
Mounting Styles SMD/SMT
Interface Type Parallel
Manufacturer GSI Technology
Brand GSI Technology
Tradename SigmaDDR-II+
RoHS Details
Memory Types DDR
Package Description LBGA, BGA165,11X15,40
Package Style GRID ARRAY, LOW PROFILE
Moisture Sensitivity Levels 3
Number of Words Code 2000000Words Codes
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA165,11X15,40
Reflow Temperature-Max (s) NOT SPECIFIED
Access Time-Max 0.45 ns
Operating Temperature-Max 70 °C
Rohs Code Yes
Manufacturer Part Number GS8662TT37BGD-400
Clock Frequency-Max (fCLK) 400 MHz
Supply Voltage-Nom (Vsup) 1.8 V
Package Code LBGA
Package Shape RECTANGULAR
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Risk Rank 5.22
Part Package Code BGA
Usage Level Commercial grade
Operating Temperature 0 to 85 °C
Series GS8662TT37BGD
Packaging Tray
JESD-609 Code e1
Pbfree Code Yes
ECCN Code 3A991.B.2.B
Type SigmaDDR-II+ B2
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PIPELINED ARCHITECTURE, LATE WRITE
HTS Code 8542.32.00.41
Subcategory Memory & Data Storage
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 1 mm
Reach Compliance Code compliant
Pin Count 165
JESD-30 Code R-PBGA-B165
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.9 V
Power Supplies 1.5/1.8,1.8 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 1.7 V
Memory Size 72 Mbit
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Supply Current-Max 800 mA
Architecture Pipelined
Organization 2 M x 36
Output Characteristics 3-STATE
Seated Height-Max 1.4 mm
Memory Width 36
Address Bus Width 20 Bit
Product Type SRAM
Density 72 Mbit
Standby Current-Max 0.245 A
Memory Density 75497472 bit
Screening Level Commercial
Parallel/Serial PARALLEL
I/O Type COMMON
Memory IC Type DDR SRAM
Standby Voltage-Min 1.7 V
Product Category SRAM
Width 13 mm
Length 15 mm
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