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- GS8182T37BGD-300
GSI Technology GS8182T37BGD-300 Memory ICs
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GS8182T37BGD-300 Tech Specifications
GSI GS8182T37BGD-300 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 8 Weeks | |
| Surface Mount | YES | |
| Number of Terminals | 165Terminals | |
| Package Description | LBGA, BGA165,11X15,40 | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Moisture Sensitivity Levels | 3 | |
| Number of Words Code | 512000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Access Time-Max | 0.45 ns | |
| Operating Temperature-Max | 70 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | GS8182T37BGD-300 | |
| Clock Frequency-Max (fCLK) | 300 MHz | |
| Number of Words | 524288 wordsWord | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Manufacturer | GSI Technology | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Risk Rank | 5.2 | |
| Part Package Code | BGA | |
| JESD-609 Code | e1 | |
| Pbfree Code | Yes | |
| ECCN Code | 3A991.B.2.B | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| HTS Code | 8542.32.00.41 | |
| Subcategory | SRAMs | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 165 | |
| JESD-30 Code | R-PBGA-B165 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Power Supplies | 1.5/1.8,1.8 V | |
| Temperature Grade | COMMERCIAL | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Operating Mode | SYNCHRONOUS | |
| Supply Current-Max | 0.455 mA | |
| Organization | 512KX36 | |
| Output Characteristics | 3-STATE | |
| Seated Height-Max | 1.4 mm | |
| Memory Width | 36 | |
| Standby Current-Max | 0.155 A | |
| Memory Density | 18874368 bit | |
| Parallel/Serial | PARALLEL | |
| I/O Type | COMMON | |
| Memory IC Type | DDR SRAM | |
| Standby Voltage-Min | 1.7 V | |
| Width | 13 mm | |
| Length | 15 mm |
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