GS8182R36BD-250 Tech Specifications

GSI  GS8182R36BD-250 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 8 Weeks
Surface Mount YES
Number of Terminals 165Terminals
Package Description LBGA,
Package Style GRID ARRAY, LOW PROFILE
Number of Words Code 512000Words Codes
Package Body Material PLASTIC/EPOXY
Reflow Temperature-Max (s) NOT SPECIFIED
Access Time-Max 0.45 ns
Operating Temperature-Max 70 °C
Rohs Code No
Manufacturer Part Number GS8182R36BD-250
Number of Words 524288 wordsWord
Supply Voltage-Nom (Vsup) 1.8 V
Package Code LBGA
Package Shape RECTANGULAR
Manufacturer GSI Technology
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Risk Rank 5.19
Part Package Code BGA
JESD-609 Code e0
Pbfree Code No
ECCN Code 3A991.B.2.B
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature PIPELINED ARCHITECTURE
HTS Code 8542.32.00.41
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 1 mm
Reach Compliance Code not_compliant
Pin Count 165
JESD-30 Code R-PBGA-B165
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.9 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 1.7 V
Operating Mode SYNCHRONOUS
Organization 512KX36
Seated Height-Max 1.4 mm
Memory Width 36
Memory Density 18874368 bit
Parallel/Serial PARALLEL
Memory IC Type DDR SRAM
Width 13 mm
Length 15 mm
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