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FT311D-32Q1C Tech Specifications

FTDI  FT311D-32Q1C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Contact plating gold-plated
Number of pins 22pins
Number of Terminals 32Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
Part Package Code QFN
Package Description HVQCCN, LCC32,.27SQ,25
Clock Frequency-Max 12 MHz
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Equivalence Code LCC32,.27SQ,25
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Supply Voltage-Max 1.98 V
Supply Voltage-Min 1.62 V
Supply Voltage-Nom 1.8 V
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2.54mm
Electrical mounting THT
Connector pinout layout 2x11
Row pitch 2.54mm
Gross weight 0.77 g
Operating temperature -40...163°C
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 0.65 mm
Reach Compliance Code compliant
Current rating 1.5A
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 32
JESD-30 Code S-XQCC-N32
Qualification Status Not Qualified
Temperature Grade AUTOMOTIVE
uPs/uCs/Peripheral ICs Type BUS CONTROLLER, UNIVERSAL SERIAL BUS
Seated Height-Max 0.9 mm
Rated voltage 60V
Bus Compatibility I2C; SPI; USB; VBUS
Data Transfer Rate-Max 0.425 MBps
Profile beryllium copper
Length 7 mm
Width 7 mm
Plating thickness 0.254µm
Flammability rating UL94V-0
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FT311D-32Q1C Documents

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