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XPC860DHZP66C1 Tech Specifications

Freescale  XPC860DHZP66C1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 357Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description BGA, BGA357,19X19,50
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA357,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Nom 3.3 V
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B357
Qualification Status Not Qualified
Power Supplies 3.3 V
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XPC860DHZP66C1 Documents

Download datasheets and manufacturer documentation for   XPC860DHZP66C1

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