XCB56007FJ50 Tech Specifications

Freescale  XCB56007FJ50 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 80Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description QFP, QFP80,.7SQ
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Equivalence Code QFP80,.7SQ
Package Shape SQUARE
Package Style FLATPACK
Supply Voltage-Nom 5 V
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Position QUAD
Terminal Form GULL WING
Terminal Pitch 0.635 mm
Reach Compliance Code unknown
JESD-30 Code S-PQFP-G80
Qualification Status Not Qualified
Power Supplies 5 V
Supply Current-Max 105 mA
Bit Size 24
Format FIXED-POINT
RAM (words) 3200
View Similar

XCB56007FJ50 Documents

Download datasheets and manufacturer documentation for   XCB56007FJ50

XCB56007FJ50 brand manufacturers: Freescale Semiconductor, Twicea stock, XCB56007FJ50 reference price.Freescale Semiconductor. XCB56007FJ50 parameters, XCB56007FJ50 Datasheet PDF and pin diagram description download.You can use the XCB56007FJ50 Embedded - DSP (Digital Signal Processors), DSP Datesheet PDF, find XCB56007FJ50 pin diagram and circuit diagram and usage method of function,XCB56007FJ50 electronics tutorials.You can download from the Twicea.