Freescale XPC860TCZP66D4 Embedded FPGAs
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XPC860TCZP66D4
Freescale XPC860TCZP66D4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 357Terminals | |
| Factory Pack QuantityFactory Pack Quantity | 4000 | |
| Manufacturer | Taiyo Yuden | |
| Brand | Taiyo Yuden | |
| RoHS | Details | |
| Package Description | BGA, BGA357,19X19,50 | |
| Package Style | GRID ARRAY | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA357,19X19,50 | |
| Operating Temperature-Min | -40 °C | |
| Supply Voltage-Nom | 3.3 V | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Supply Voltage-Min | 3.135 V | |
| Rohs Code | No | |
| Manufacturer Part Number | XPC860TCZP66D4 | |
| Clock Frequency-Max | 66 MHz | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MOTOROLA INC | |
| Supply Voltage-Max | 3.465 V | |
| Risk Rank | 5.69 | |
| Series | MCAR | |
| ECCN Code | 3A001.A.3 | |
| HTS Code | 8542.31.00.01 | |
| Subcategory | Capacitors | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Terminal Pitch | 1.27 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | S-PBGA-B357 | |
| Qualification Status | Not Qualified | |
| Power Supplies | 3.3 V | |
| Speed | 66 MHz | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC | |
| Bit Size | 32 | |
| Halogen Free | Not Halogen Free | |
| Seated Height-Max | 2.05 mm | |
| Address Bus Width | 32 | |
| Product Type | Ceramic Capacitors | |
| Boundary Scan | YES | |
| Low Power Mode | YES | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| Product Category | Multilayer Ceramic Capacitors MLCC - SMD/SMT | |
| Width | 25 mm | |
| Length | 25 mm |
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