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MC9S08RD8CPE Tech Specifications
Freescale MC9S08RD8CPE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Contact Plating | Gold | |
| Housing Material | Thermoplastic | |
| Voltage, Rating | 200 V | |
| Contact Materials | Bronze | |
| RoHS | Compliant | |
| Package Description | , | |
| Manufacturer Part Number | MC9S08RD8CPE | |
| Manufacturer | NXP Semiconductors | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Risk Rank | 5.39 | |
| Packaging | Tape & Reel | |
| Termination | Solder | |
| Number of Positions | 26Positions | |
| Max Operating Temperature | 125 °C | |
| Min Operating Temperature | -55 °C | |
| Number of Rows | 2Rows | |
| HTS Code | 8542.31.00.01 | |
| Pitch | 2 mm | |
| Technology | CMOS | |
| Orientation | Straight | |
| Depth | 4 mm | |
| Reach Compliance Code | unknown | |
| Current Rating | 1 A | |
| Number of Contacts | 26Contacts | |
| Housing Color | Black | |
| Contact Resistance | 20 mΩ | |
| Insulation Resistance | 1 GΩ | |
| Max Voltage Rating (AC) | 200 V | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER | |
| Length | 25.92 mm | |
| Radiation Hardening | No |
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