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FDMM008G-CAB Tech Specifications

FLEx  FDMM008G-CAB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Surface Mount YES
Housing Material Liquid Crystal Polymer (LCP)
Number of Terminals 8Terminals
Number of Positions or Pins (Grid) 1944 (G34)
Contact Material - Mating Copper Alloy
Contact Material - Post --
Contact Finish Mating Gold
Package Style UNCASED CHIP
Number of Words Code 8G
Package Body Material UNSPECIFIED
Operating Temperature-Min 0
Operating Temperature-Max 70
Number of Words 8589934592Words
Package Code DIE
Package Shape RECTANGULAR
Package Description CARD-8
Manufacturer Part Number FDMM008G-CAB
Manufacturer Flexxon Pte Ltd
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer FLEXXON GLOBAL LTD
Risk Rank 5.77
Operating Temperature --
Series --
Packaging Tray
Part Status Active
Termination Solder
Type LGA
Technology CMOS
Terminal Position UPPER
Terminal Form NO LEAD
Number of Functions 1Function
Reach Compliance Code unknown
Current Rating 1A
Pitch - Mating 0.039 (1.00mm)
JESD-30 Code R-XUUC-N8
Contact Finish - Post --
Supply Voltage-Max (Vsup) 3.6
Contact Resistance --
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 2.7
Operating Mode ASYNCHRONOUS
Organization 8GX8
Memory Width 8
Memory Density 68719476736
Parallel/Serial SERIAL
Memory IC Type FLASH CARD
Termination Post Length --
Pitch - Post 0.039 (1.00mm)
Programming Voltage 2.7
Features Open Frame
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Contact Finish Thickness - Post --
Material Flammability Rating UL94 V-0
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