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DIP050-628-157BLF Tech Specifications

FCI  DIP050-628-157BLF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case 0805 (2012 Metric)
Supplier Device Package 0805
Housing Material POLYESTER
Package Tape & Reel (TR)
Base Product Number RN732A
Mfr KOA Speer Electronics, Inc.
Product Status Obsolete
Package Description LEAD FREE
Contact Finish Mating TIN (100) OVER NICKEL
Manufacturer Part Number DIP050-628-157BLF
Manufacturer Amphenol FCi
Part Life Cycle Code Obsolete
Ihs Manufacturer FCI
Risk Rank 5.84
Manufacturer Series DIP050
Operating Temperature -55°C ~ 155°C
Series RN73
Size / Dimension 0.079 L x 0.049 W (2.00mm x 1.25mm)
Tolerance ±0.5%
JESD-609 Code e3
Number of Terminations 2Terminations
ECCN Code EAR99
Temperature Coefficient ±25ppm/°C
Resistance 85.6 Ohms
Composition Thin Film
Power (Watts) 0.1W, 1/10W
Additional Feature STANDARD: UL 94V-0
HTS Code 8536.69.40.40
Reach Compliance Code unknown
Number of Contacts 28Contacts
Contact Finish Termination TIN (200) OVER NICKEL
Device Socket Type IC SOCKET
Device Type Used On DIP28
Features Moisture Resistant
Height Seated (Max) 0.024 (0.60mm)
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