- Connectors, Interconnects
- D-Sub Connectors
- DBPL25S364TLF
Min. : 1
Mult. : 1
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DBPL25S364TLF
FCI DBPL25S364TLF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mounting Type | BOARD AND PANEL | |
| Shell Material | STEEL | |
| Package Description | LEAD FREE | |
| Shell Sizes | 3/B | |
| Contact Finish Mating | GOLD FLASH OVER NICKEL | |
| Insulator Material | POLYETHYLENE | |
| Rohs Code | Yes | |
| Manufacturer Part Number | DBPL25S364TLF | |
| Contact Materials | COPPER ALLOY | |
| Manufacturer | Amphenol ICC | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | AMPHENOL ICC | |
| Risk Rank | 5.68 | |
| Connector Type | D SUBMINIATURE CONNECTOR | |
| MIL Conformance | NO | |
| DIN Conformance | NO | |
| IEC Conformance | NO | |
| Filter Feature | NO | |
| Mixed Contacts | NO | |
| Option | GENERAL PURPOSE | |
| Total Number of Contacts | 25Contacts | |
| Reach Compliance Code | compliant | |
| Shell Finish | TIN/ZINC CHROMIUM | |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE | |
| Contact Gender | FEMALE | |
| UL Flammability Code | 94V-0 | |
| Empty Shell | NO | |
| Termination Type | SOLDER | |
| Contact Finish Termination | Gold Flash (Au) |
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