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MR25H256MDF Tech Specifications

Everspin Technologies  MR25H256MDF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 14 Weeks
Mounting Type Surface Mount
Package / Case 8-VDFN Exposed Pad
Surface Mount YES
Memory Types Non-Volatile
Usage Level Automotive grade
Operating Temperature -40°C~125°C TA
Packaging Tray
Published 2013
Series Automotive, AEC-Q100
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
ECCN Code EAR99
HTS Code 8542.32.00.71
Max Power Dissipation 600mW
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 8
JESD-30 Code R-PDSO-N8
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Interface SPI, Serial
Memory Size 256Kb 32K x 8
Operating Mode SYNCHRONOUS
Clock Frequency 40MHz
Memory Format RAM
Memory Interface SPI
Data Bus Width 8b
Organization 32KX8
Memory Width 8
Memory Density 262144 bit
Length 6mm
Height Seated (Max) 0.9mm
RoHS Status ROHS3 Compliant
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MR25H256MDF Documents

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