ERNI Electronics 53007 Backplanes
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53007 Tech Specifications
ERNI Electronics 53007 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Contact Plating | Gold Over Nickel | |
| EU RoHS | Compliant | |
| ECCN (US) | EAR99 | |
| HTS | 8536.69.40.40 | |
| Automotive | No | |
| PPAP | No | |
| Termination Method | Press Fit | |
| Terminal Pitch (mm) | 2 | |
| Body Orientation | Straight | |
| Speed Rating (Gbps) | 2 | |
| Insulation Resistance (MOhm) | 10000 | |
| Maximum Contact Resistance (MOhm) | 5 | |
| Minimum Operating Temperature (°C) | -55 | |
| Maximum Operating Temperature (°C) | 125 | |
| Mating Cycle (Cycles) | 250 | |
| Product Depth (mm) | 15.4 | |
| Mounting | Through Hole | |
| Pitch (mm) | 2(mm) | |
| Contact Materials | Phosphor Bronze | |
| Mounting Styles | Through Hole | |
| Operating Temp Range | -55C to 125C | |
| Number of Contact Rows | 7Contact Rows | |
| Part Status | LTB | |
| Type | Hard Metric | |
| Gender | M | |
| Number of Contacts | 154Contacts | |
| Product Length (mm) | 50 | |
| Product Height (mm) | 13.45 |
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