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895-017-524-412 Tech Specifications

EDAC  895-017-524-412 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Contact Plating Gold
Mounting Type Through Hole
Housing Material Polyphenylene Sulfide (PPS)
Material - Insulation Polyphenylene Sulfide (PPS)
Factory Pack QuantityFactory Pack Quantity 1
Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 125 C
Contact Materials Copper Alloy
Mounting Styles Panel Mount
RoHS Details
Product Status Active
Mfr EDAC Inc.
Base Product Number 895-017
Package Bulk
Series 895
Operating Temperature -40°C ~ 125°C
Termination Solder
Number of Positions 17 PositionPosition
Color Black
Number of Rows 1 RowRow
Gender Female
Contact Type Cantilever
Pitch 2.54 mm
Current Rating 3 A
Contact Finish Gold
Termination Style Solder Pin
Card Type Non Specified - Single Edge
Read Out Single
Insulation Resistance 5000 MOhms
Number of Positions/Bay/Row 17Positions/Bay/Rows
Flange Feature Side Mount Opening, Unthreaded, 0.128 (3.25mm) Dia
Product Receptacles
Mounting Angle Vertical
Features -
Contact Finish Thickness 10.0µin (0.25µm)
Card Thickness 0.054 ~ 0.070 (1.37mm ~ 1.78mm)
Board Thickness 1.57 mm
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