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DMB54D0UDW-7 Tech Specifications
Diodes DMB54D0UDW-7 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 18 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 6-TSSOP, SC-88, SOT-363 | |
| Number of Pins | 6Pins | |
| Weight | 6.010099mg | |
| Number of Elements | 1 Element | |
| Voltage Rated | 45V PNP 50V N-Channel | |
| Packaging | Tape & Reel (TR) | |
| Published | 2009 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 6Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Matte Tin (Sn) | |
| Max Operating Temperature | 150°C | |
| Min Operating Temperature | -55°C | |
| Applications | General Purpose | |
| Additional Feature | ESD PROTECTION, LOW THRESHOLD | |
| Current Rating (Amps) | 100mA PNP 160mA N-Channel | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Current Rating | 160mA | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Base Part Number | DMB54D0U | |
| Pin Count | 6 | |
| Qualification Status | Not Qualified | |
| Configuration | SINGLE WITH BUILT IN BIPOLAR TRANSISTOR AND DIODE | |
| Operating Mode | ENHANCEMENT MODE | |
| Transistor Application | SWITCHING | |
| Drain to Source Voltage (Vdss) | 50V | |
| Transistor Type | PNP, N-Channel | |
| Continuous Drain Current (ID) | 160mA | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| Power Dissipation-Max (Abs) | 0.25W | |
| Collector Current-Max (IC) | 0.1A | |
| DC Current Gain-Min (hFE) | 220 | |
| Drain to Source Resistance | 5Ohm | |
| VCEsat-Max | 0.4 V | |
| REACH SVHC | No SVHC | |
| RoHS Status | ROHS3 Compliant |
DMB54D0UDW-7 Documents
Download datasheets and manufacturer documentation for DMB54D0UDW-7
- Environmental InformationDiodes RoHS 3 Cert
- PCN Assembly/OriginMult Devices Rev 21/Apr/2017
- DatasheetsDMB54D0UDW
- PCN Design/SpecificationBond Wire 11/Nov/2011
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