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B2100-13-F Tech Specifications

Diodes  B2100-13-F technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 19 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case DO-214AA, SMB
Number of Pins 2Pins
Weight 92.986436mg
Diode Element Material SILICON
Number of Elements 1 Element
Packaging Tape & Reel (TR)
Published 2017
JESD-609 Code e3
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
Termination SMD/SMT
ECCN Code EAR99
Max Operating Temperature 150°C
Min Operating Temperature -65°C
Applications EFFICIENCY
Additional Feature LOW POWER LOSS, FREE WHEELING DIODE
Capacitance 75pF
Voltage - Rated DC 100V
Terminal Position DUAL
Terminal Form C BEND
Peak Reflow Temperature (Cel) 260
Current Rating 2A
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number B2100
Pin Count 2
Polarity Standard
Element Configuration Single
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Schottky
Current - Reverse Leakage @ Vr 7μA @ 100V
Output Current 2A
Voltage - Forward (Vf) (Max) @ If 790mV @ 2A
Forward Current 2A
Operating Temperature - Junction -65°C~150°C
Forward Voltage 790mV
Max Reverse Voltage (DC) 100V
Average Rectified Current 2A
Number of Phases 1Phase
Peak Reverse Current 7μA
Max Repetitive Reverse Voltage (Vrrm) 100V
Capacitance @ Vr, F 75pF @ 4V 1MHz
Peak Non-Repetitive Surge Current 50A
Reverse Voltage 100V
Max Forward Surge Current (Ifsm) 50A
Max Junction Temperature (Tj) 150°C
Height 2.5mm
Length 4.57mm
Width 3.94mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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B2100-13-F Documents

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