- Fans, Thermal Management
- Thermal - Heat Sinks
- BDN18-3CB/A01
Min. : 1
Mult. : 1
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BDN18-3CB/A01
CTS BDN18-3CB/A01 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Fin Style | Pin Array | |
| Mounting Styles | Adhesive | |
| Heatsink Material | Aluminum | |
| Designed for | BGA, PGA, PLCC, QFP | |
| Series | BND | |
| Type | Passive | |
| Attachment Method | Adhesive Tape | |
| Product | Heat Sinks | |
| Product Length | 45.97 mm | |
| Thermal Resistance | 10.8 °C/W | |
| Width | 45.97 mm | |
| Height | 9.02 mm | |
| Length | 45.97 mm |
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