BDN18-3CB/A01

CTS  BDN18-3CB/A01 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Fin Style Pin Array
Mounting Styles Adhesive
Heatsink Material Aluminum
Designed for BGA, PGA, PLCC, QFP
Series BND
Type Passive
Attachment Method Adhesive Tape
Product Heat Sinks
Product Length 45.97 mm
Thermal Resistance 10.8 °C/W
Width 45.97 mm
Height 9.02 mm
Length 45.97 mm
BDN18-3CB/A01 brand manufacturers: CTS, Twicea stock, BDN18-3CB/A01 reference price.CTS. BDN18-3CB/A01 parameters, BDN18-3CB/A01 Datasheet PDF and pin diagram description download.You can use the BDN18-3CB/A01 Thermal - Heat Sinks, DSP Datesheet PDF, find BDN18-3CB/A01 pin diagram and circuit diagram and usage method of function,BDN18-3CB/A01 electronics tutorials.You can download from the Twicea.