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BDN09-3CB/A01

CTS  BDN09-3CB/A01 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Fin Style Pin Array
Product Depth (mm) 23.114(mm)
Device Cooled BGA/PGA/PLCC/QFP
Product Diameter (mm) Not Required(mm)
Rad Hardened No
Mounting Styles Adhesive
Heatsink Material Aluminum
Designed for BGA, PGA, PLCC, QFP
Type Passive
Attachment Method Adhesive Tape
Finish Black Anodized
Product Heatsinks
Product Length 23.114 mm
Thermal Resistance 26.9°C/W
Product Length (mm) 23.114(mm)
Width 23.11 mm
Height 9.02 mm
Length 23.11 mm
Product Height (mm) 9.017(mm)
BDN09-3CB/A01 brand manufacturers: CTS, Twicea stock, BDN09-3CB/A01 reference price.CTS. BDN09-3CB/A01 parameters, BDN09-3CB/A01 Datasheet PDF and pin diagram description download.You can use the BDN09-3CB/A01 Thermal - Heat Sinks, DSP Datesheet PDF, find BDN09-3CB/A01 pin diagram and circuit diagram and usage method of function,BDN09-3CB/A01 electronics tutorials.You can download from the Twicea.