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CAS300M17BM2

Cree  CAS300M17BM2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 19 Weeks
Mounting Type Chassis Mount
Package / Case Module
Number of Pins 7Pins
Supplier Device Package Module
Current - Continuous Drain (Id) @ 25℃ 325A Tc
Operating Temperature -40°C~150°C TJ
Packaging Tray
Series Z-Rec®
Published 2014
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Operating Temperature 150°C
Max Power Dissipation 1.76kW
Power - Max 1760W
FET Type 2 N-Channel (Half Bridge)
Rds On (Max) @ Id, Vgs 10mOhm @ 225A, 20V
Vgs(th) (Max) @ Id 2.3V @ 15mA (Typ)
Input Capacitance (Ciss) (Max) @ Vds 20000pF @ 1000V
Gate Charge (Qg) (Max) @ Vgs 1076nC @ 20V
Drain to Source Voltage (Vdss) 1700V 1.7kV
Continuous Drain Current (ID) 300A
Threshold Voltage 2.3V
FET Feature Silicon Carbide (SiC)
Drain to Source Resistance 8mOhm
Height 30mm
Length 106.4mm
Width 61.4mm
REACH SVHC Unknown
RoHS Status RoHS Compliant

CAS300M17BM2

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